





Standard Production Capability
Process Item 2020
Line width 3 mil Conductor spacing 3 mil
Inner layer Pad size(base on min annular ring 2 mil) 22 mil(6 mil F H S)
Min core thickness 4 mil/0.1 mm
Drill hole to copper spacing 6 mil/0.15 mm Lamination Layer Count (FR-4) 2-12
Layer Count (P T F E) 2-6
Board Thickness 20 mil/100 mm0.5 mm-3.0 mm
Drilling Min finished hole size(Through hole) 6 mil/0.15 mm
Plating Aspect Ratio
Board thickness/Through hole size â¤10
Outer Layer Line width 3 mil
Conductor spacing 3 mil
Pad size(base on min annular ring 2 mil) 18 mil (6 mil F H S)
Solder Mask Min. S M D pad spacing 7 mil
Min. solder mask dam 3 mil
Min solder mask clearance 1.5 mil
Punch/ Routing Punch profile tolerance ±4 mil
Routing profile tolerance ±4 mil
Surface Treatment Immersion Gold thickness 1-6 u"
Immersion Nickel thickness 80-200 u"
Immersion Tin thickness 0.8-1.2 um
Immersion Silver thickness 0.1-0.4 um
O S P thickness 0.2-0.5 um
H A S L thickness 1-25 um
H A S L free thickness 2-25 um